Who We Are…
International Microelectronics and Packaging Society – Poland Chapter (ISHM-Poland Chapter) was organised by a group of 12 founder members who met in Kraków in September 1981. Formally, the Chapter was established in September 1982. It was an independent, non-profit making organisation which aim was to spread of knowledge relating to hybrid microelectronics – a key technology in the assembly and application of silicon chip semiconductors, film circuits and printed wiring boards to form practical miniaturised electronic equipment. It was opened to all individuals connected in any way with hybrid microelectronics. The members of ISHM-Poland Chapter became people from technical universities, research centres, electronic factories all over Poland. The Polish Chapter was a part of the worldwide organisation International Society for Hybrid Microelectronics settled in Reston, Virginia, USA.
In 1997 in the USA, the International Society for Hybrid Microelectronics (ISHM) joined the International Electronic Packaging Society (IEPS) and as a result the International Microelectronics And Packaging Society (IMAPS) was created . On 8th November 1997 at a meeting in Ustron during the XXIst ISHM Poland Conference, Polish members of ISHM also decided to join IMAPS. ISHM-Polish Chapter was transformed into IMAPS-Polish Chapter.
Every year the section organizes technical conferences and seminars where the members meet, discuss and exchange information.
Address of IMAPS-Poland Chapter:
PL 30-701 Kraków, 39 Zablocie Str.
Phone: (48 12) 656 51 83
Fax: (48 12) 656 36 26
Advanced SiP 2021International Conference on System-in-Package (SiP) Technology
EMPC 202123rd European Microelectronics and Packaging Conference
Tools for Remote Teaching: an Extreme Challenge arising from the PandemicDistinguished Speaker Webinars
San Diego, CA
POWER 2021From Nano to Macro Power Electronics and Packaging European Workshop
MiNaPAD 2022Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum