EMPC 2021

The European Microelectronics and Packaging Conference (EMPC) 2021 offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. In the present circumstances with the Covid 19 situation the EMPC 2021 will be held online from September 13 to 16, 2021. In addition to our program, we will organise break-out rooms that are accessible for mingling and networking during breaks and lunches. You can register for the conference here.

The EMPC will focus on the following topics:

• Advanced Packaging: 3D integration, System-in Packages, FI- and FO-WLP, innovative interconnects, circuit solutions, Panel level packaging, Substrate and Interposer Technologies, emerging Heterogenous Integration Technologies
• Advanced packaging for MEMS & sensors: Sensors, actuators and RF systems
• Electronics Reliability & Quality: Methodology, Predictive maintenance, Novel reliability test methods., Modelling, Statistical reliability analysis and life models, Failure analysis and material characterization
• Green Technologies: Recycling, supply chain, low power computing
• Harsh environment applications: Aerospace, automotive, rail, washable wearables, smart farming, drilling, HTHP (high temperature and high pressure) O&G wells, geothermal energy and process industry
• Materials & Processes: Manufacturing and assembly technologies, new materials, compatibility, enabling materials, nano-materials and processes
• Medical electronics: Implantable devices, miniaturization, neural interfaces, validation, new trends, reliability of implanted electronics, sensors for (implantable) medical devices
• Opto-electronics: Packaging, light sources, detectors, photonic integrated circuits based on III-V/Si technology platforms, emerging materials, applications
• Power electronics: Packaging, Thermal management, Wide Bandgap applications, Energy-conversion technologies
• Printed electronics: Materials and processes, Flexible, Structural, Applications (automotive, energy, medical, wearable and others)

Sponsors & Exhibitors:
The conference will host its exhibition from September 14 to 15, 2021 giving your company the opportunity to get in touch with the world’s leading packaging scientists, engineers and companies. If you are interested in participating as an exhibitor, you can find all necessary information here.