International Microelectronics and Packaging Society Europe
International Microelectronics and Packaging Society Europe
International Microelectronics and Packaging Society Europe
International Microelectronics and Packaging Society Europe
International Microelectronics and Packaging Society Europe
International Microelectronics and Packaging Society Europe
International Microelectronics and Packaging Society Europe
Centre for Advanced Technologies ITR Centre for Advanced Technologies ITR develops new materials and technologies for electronic industry. These include: new technologies of PWBs with resistive and capacitive elements inside, new soldering alloys, nano-pastes and technologies for assembly electronic components on HDI PWBs, nano-inks and technologies for printed electronics. The Centre cooperates also with companies from electronic sector and helps them in resolving assembly problems (Contact: Janusz Sitek: janusz.sitek@itr.org.pl)
HIPOT-RR (HIPOT-R&D Research and Development in Technologies and Systems) HIPOT-RR (HIPOT-R&D Research and Development in Technologies and Systems) is Slovenian small research organization. HIPOT-RR has capabilities on technologies (thick-film, LTCC), knowledge on numerical modelling, and experience on design and fabrication of different ceramic electro-mechanic microsystems. HIPOT-RR traditionally cooperates with the Electronic Ceramics Department at the Jozef Stefan Institute, Ljubljana, Slovenia. (contact: Darko Belavic; darko.belavic@ijs.si)
Laboratory for Advanced Interconnecting and Packaging Materials Laboratory for Advanced Interconnecting and Packaging Materials is active in research of wafer level assembly (wire bonding, flip chip bonding) as well as die attach technologies (hard soldering, Ag nano- and micropowder sintering), thin and thick film technologies, ecological packaging materials for high temperature application and silicon micromachining processes for fabrication of microfluidic optical sensors. (contact: kisiel@imio.pw.edu.pl)
Laboratory for Interconnecting and Packaging Electronic Circuits Laboratory for Interconnecting and Packaging Electronic Circuits is active in: reliability testing and numerical prototyping of microelectronic components and micro-system packages; developing nanocomposites and electrically conductive microstructures for printed, flexible electronics, thermally conductive composites with nano- and micro-fillers; heat transfer modeling in molecular- and bulk-scale domain and packaging oriented to green electronics (contact: Jan Felba; http://www.lipec.info)
Laboratory of Electromagnetic Compatibility Laboratory of Electromagnetic Compatibility specializes in immunity measurements on electromagnetic fields in frequency range to 1GHz and 6GHz (with stress level to 10V/m), emission measurements of electrical and electronic devices in the range to 18GHz (conducted and radiated disturbances). It allows for immunity measurements of electrical and electronic devices on conducted disturbances induced by radio frequency fields, immunity measurements on surges and electrical fast transients disturbances in 1- and 3-phase objects (contact: Wiesław Sabat, e-mail: wsabat@prz.edu.pl)
Laboratory of Functional Materials Laboratory of Functional Materials is working in the field of low temperature, cost effective technologies for fabrication of electroceramic and hybrid devices including gas sensors, fuel cells, gas separation membranes, etc. The technologies (spin coating, spray pyrolysis, dip coating) utilize metallo-organic polymers for thin and thick, dense and porous functional layers fabrication. (contact: Piotr Jasiński; pijas@eti.pg.edu.pl)
Laboratory of Integrated Electronic Micro- and Nanotechnology Laboratory of Integrated Electronic Micro- and Nanotechnology specializes in synthesis of micro and nanostructures for hybrid electronics, especially implementation in RFID technology, optoelectronic devices, sensors, alternative sources of power and energy storage systems. Extra opportunity: circuits synthesis with taking into account such aspects as temperature field and reliability analysis, electromagnetic compatibility EMC (contact: Mariusz Węglarski, e-mail: wmar@prz.edu.pl)
Laboratory of Material Characterization of Micro- and Nanostructures Laboratory of Material Characterization of Micro- and Nanostructures provides equipment for characterization of physical and chemical properties of materials as well as micro- and nanoscale structures. The up-to-date instrumentation enables the performance of observations and analyses of test samples surface morphology (e.g. topography, structure) as well as their surface and bulk chemical composition. (contact: Piotr Firek, e-mail: pfirek@elka.pw.edu.pl)
Laboratory of Microelectronics and Integrated Circuit Design Laboratory of Microelectronics and Integrated Circuit Design specializes in the design and analysis of analog, digital, and mixed-signal ICs, including high-voltage Smart Power, MEMS systems, and a wide range of sensors and actuators. The laboratory is equipped with Cadence, Synopsys and Mentor Graphics EDA tools. Owing to the participation in Europractice and Cadence Academic Network, it has access to numerous design-kits and specialized training programs (contact: Zygmunt Ciota; jankowsk@dmcs.pl)
Laboratory of Radio Frequency IDentification RFID Technique Laboratory of Radio Frequency IDentification RFID Technique specializes in design and implementation of transponders, antennas and read/write devices to any static or dynamic, single or anticollision process of automatic identification; development of algorithms for synthesis of 3D interrogation zone and antenna systems. Extra opportunity: manufacturing electronic structures of RFID devices; testing for EMC standards compliance; access to automated production lines of electronics in local factory/cooperator (contact: Piotr Jankowski-Mihułowicz, pjanko@prz.edu.pl)
Laboratory of Thermal Measurements Laboratory of Thermal Measurements specializes in the dynamic thermal and electro-thermal characterization and modeling of electronic devices and packages. The laboratory is equipped with the dedicated stand and tools compliant with the JEDEC JESD-51 standard. It features also an advanced system for active control of cooling conditions and a very high speed multichannel measurement board allowing sampling of temperature sensors at 1Msps (contact: Andrzej Napieralski; janicki@dmcs.pl)
Structure Investigations Laboratory Structure Investigations Laboratory conducts XRD and SEM analysis. Laboratory offers a support to manufacturers of polycrystalline materials and producers using these materials. Material structure investigation is useful tool that provides information about service condition impact on product function or malfunction. It enables the merit consideration on material/material formulation. Laboratory is also involved in fire hazard and flammability testing (contact: Witold Mielcarek; mielcar@iel.wroc.pl)
Thick-Film Microsystems Laboratory Thick-Film Microsystems Laboratory is active in thick film and LTCC (Low Temperature Cofired Ceramics) technology: miniaturization of passive components, thermoelectric microgenerators, sensors and actuators, microheater and microcooling systems, microfluidic systems, biological microsystems, chemical microreactors, optoelectronic and microwave device, LTCC packaging for MEMS and MOEMS (contact: prof. Leszek Golonka; Leszek.Golonka@pwr.wroc.pl)
Vacuum & Plasma Technology Division Vacuum & Plasma Technology Division is active in vacuum technology and technique. Especially we are involved in magnetron sputtering processes (magnetron design and thin film deposition). Field electron emission phenomena from composites are investigated. The charged particles optic is also the field of the interest (the support for SEM devices) (contact: Zbigniew Znamirowski; zbigniew.znamirowski@pwr.wroc.pl)
