The Advanced Power Electronics Packaging Symposium, which will be held online from April 26 to 29, 2021, specifically addresses current market needs and corresponding technical developments for electronics thermal management. Presentations on leading-edge developments in thermal management components, materials, and systems solutions for effectively dissipating heat from microelectronic devices and systems are sought from industry and academia. The symposium emphasizes practical, high-performance solutions that target current and evolving requirements in mobile, computing, telecom, power electronics, military, and aerospace systems.
The symposium will be covering the following topics:
Mobile and Handheld Devices and the Internet-of-Things (IoT)
Wireless and Telecom Infrastructure
Power Semiconductor Thermal Components, Systems, and Solutions
Data Center Cooling
Liquid cooling, Phase-change, and Refrigeration
Thermal Interface Materials (TIMs) and Testing
CTE-Matching and High Thermal Conductivity Materials
New this year – a technology cross-over extravaganza! CICMT, HiTEC and Thermal & Power Solutions come together for a great opportunity for you: one location, one registration and three times the content, networking, and learning! You can register for the event here.